Special Issue Film Materials and Devices
Thin films are
fabricated by the deposition of individual atoms on a substrate. Thin film
materials and devices are also available for minimization of toxic materials
since the quantity used is limited only to the surface and/or thin film layer.
Thin film processing also saves on energy consumption in production and is
considered an environmentally benign material technology for the next century. The
goal of this special issue is to provide a platform for scientists and
academicians all over the world to promote, share, and discuss various new
issues and developments in the area of film
materials and devices.
In
this special issue, we invite front-line researchers and authors to submit
original research and review articles that explore film materials and devices. In this special issue, potential
topics include, but are not limited to:
-
Ceramic
thin films
-
Electronic
film materials
-
Thin
film technology and deposition processes
-
Structural
control of compound thin films
-
Properties
of thin SiO2 Layers
-
Semiconductor
thin film material
-
Nanometer
thin film materials
-
Dielectric
film materials
Authors
should read over the journal’s For
Authors carefully before submission.
Prospective authors should submit an electronic copy of their complete manuscript
through the journal’s Paper
Submission System.
Please kindly specify the “Special Issue” under your manuscript title. The research field “Special
Issue –Film Materials and Devices” should
be selected during your submission.
Special Issue timetable:
Submission
Deadline
|
August
20th, 2020
|
Publication
Date
|
October
2020
|
Guest Editor:
For
further questions or inquiries
Please
contact Editorial Assistant at
msce@scirp.org