•   Home
  • Proceedings
  • Proceedings of the 7th National Conference on Functional Mat...

Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK)

Changsha,China,10.16-10.18,2010

ISBN: 978-1-935068-41-9 Scientific Research Publishing, USA

E-Book 2313pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $360

Title: Fabrication of Inlay Structure Diamond Films on Cu Substrate and the Evaluation of Adhesion Strength
Source: Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK) (pp 1936-1939)
Author(s): Wan-qi Qiu, School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
Yan-xiang Zeng, School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
Li-xian He, School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
Zhong-wu Liu, School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
De-chang Zeng, School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
Xi-chun Zhong, School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
Hong-ya Yu, School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
Abstract: A continuous diamond film was successfully fabricated on copper substrate in hot-filament chemical vapor deposition method by electroplating Cu-Diamond composite interlayer. The adhesive strength of diamond on copper substrate was evaluated by indentation test. The diamond films were also characterized by scanning electron microscope (SEM) and Raman spectrum. The results shows that the adhesive strength between diamond film and Cu substrate can be improved by employing Cu-diamond composite interlayer. Furthermore, the adhesive strength can be greatly increased by using Cu-0.2%Cr alloy instead of Cu to post planting the diamond particles on the composite plating process.
Proceedings by Subjects
Resources
Products
Contact us
book@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1243940697
Book Publishing WeChat
Follow SCIRP
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top