Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK)

Changsha,China,10.16-10.18,2010

ISBN: 978-1-935068-41-9 Scientific Research Publishing, USA

E-Book 2313pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $360

Title: Effect of Cooling Rate on Microstructures during Solidification of Liquid Ge
Source: Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK) (pp 1274-1277)
Author(s): Chang-yin Zhu, college of materials and metallurgy, Guizhou University, Guizhou, China
Quan Xie, College of science, Guizhou University, Guizhou, China
Ting-hong Gao, College of science, Guizhou University, Guizhou, China
Abstract: A molecular dynamics simulation has been performed on the solidification process of liquid metal Ge by adopting the Stillinger-Weber potentials at three different cooling rates. Through the pair correlation function,bond-type index method, self-diffusion coefficient D(T), the microstructures have been analyzed during rapid solidification processes. It is found that random network amorphous solids are formed at the cooling rate of 1×1012K/s, 1×1013K/s and 1×1014K/s. The influence of cooling rate on the system is only shown under 1000K. At lower cooling rate, the bond angle, coordination number and bond type are more close to the crystal structure of Ge, and crystallization occurs more obvious.
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