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Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK)

Changsha,China,10.16-10.18,2010

ISBN: 978-1-935068-41-9 Scientific Research Publishing, USA

E-Book 2313pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $360

Title: Microstructure of Rehandled Layer on the Surface of Nano-CuCr Alloy
Source: Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK) (pp 1350-1353)
Author(s): Jia Cheng, School of Science, Xi’an Jiaotong University, Xi’an, China
Heng Zhang, School of Science, Xi’an Jiaotong University, Xi’an, China
Zhi-mao Yang, School of Science, Xi’an Jiaotong University, Xi’an, China
Bing-jun Ding, School of Science, Xi’an Jiaotong University, Xi’an, China
Abstract: Nano-CuCr25 and nano-CuCr50 alloys are prepared by vacuum hot pressing using powders activated by high energy ball-milling. The surface of the alloys after arc erosion and the rehandled layer are studied. The depth of the rehandled layer on nano-CuCr50 is found to be 3~6 micrometers at low current and the microstructure is refined. At high-current，the rehandled layer of nano-CuCr25 is found to be about 3~4 micrometers. Compared with normal CuCr25 alloy, nano-CuCr25 is more stable as cathode. Anode spots which can destroy the contact occur at high-current. Arc energy of nano-CuCr25 is lower than that of normal CuCr25 alloy.
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