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Author(s): |
Meng Liu, College of Aerospace and Materials Engineering, National University of Defense Technology, Hunan Changsha 410073
Hong Wan, College of Aerospace and Materials Engineering, National University of Defense Technology, Hunan Changsha 410073
Hong Zhang, College of Aerospace and Materials Engineering, National University of Defense Technology, Hunan Changsha 410073
Shu-xin Bai, College of Aerospace and Materials Engineering, National University of Defense Technology, Hunan Changsha 410073 |
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Abstract: |
The evolution of silicon phase configuration and the changes in hermeticity, bend strength, thermal conductivity and coefficients of thermal expansion of Sip/Al composites during different kinds of heat treatment were investigated in this article. It is discovered that the configuration evolution during heat treatment is as follows: the corners and edges of the silicon particles are dissolved; the small silicon particles are dissolved and disappeared finally; the big silicon particles become bigger and reticular. It is also discovered that, after 420℃×1h heat treatment, the changes of the hermeticity of Sip/Al composites are not obvious; however, the bend strength, thermal conductivity and coefficients of thermal expansion decreased obviously; after 600℃×1h and 600℃×4h heat treatment, the lacunae in Sip/Al composites increased obviously, which greatly affect the properties of the composites.
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