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Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK)

Changsha,China,10.16-10.18,2010

ISBN: 978-1-935068-41-9 Scientific Research Publishing, USA

E-Book 2313pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $360

Title: Effect of P, Ag on the Oxidation-Resistance of Sn-0.5Cu Lead-Free Solder
Source: Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK) (pp 609-613)
Author(s): Si-dong Liu, College of Science and Engineering, Southeast University, Jiangsu Nanjing 211189, China
Feng Xue, College of Science and Engineering, Southeast University, Jiangsu Nanjing 211189, China
Jian Zhou, College of Science and Engineering, Southeast University, Jiangsu Nanjing 211189, China
Abstract: Sn-Cu based solder is widely used in wave soldering, however, oxidization is the problem in use. The waste of solder and poor welding quality can be caused by the oxidation of the solder. In this paper, some trace elements (P and Ag) have been added into the binary alloy Sn0.5Cu to study dynamic oxidation resistance of the solder. Oxidation surface have been examinated by auger electron spectrometer (AES) to discover the mechanism of improving the solder’s oxidation resistance. The result shows that the trace P can significantly improve the oxidation resistance of Sn0.5Cu alloy, and Ag can both increase the alloy’s oxidation resistance. P and Ag have been simultaneously added into Sn0.5Cu alloy to get a better antioxidant effect that is based on the different anti-oxidation mechanism of the two elements.
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