•   Home
  • Proceedings
  • Proceedings of the 17th IAPRI World Conference on Packaging ...

Proceedings of the 17th IAPRI World Conference on Packaging (IAPRI 2010 E-BOOK)

Tianjin,China,10.12-10.15，2010

ISBN: 978-1-935068-36-5 Scientific Research Publishing, USA

E-Book 886pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $80

Title: Over Packaging on IT Products And Its Wastes Proceeding for Environment Protection
Source: Proceedings of the 17th IAPRI World Conference on Packaging (IAPRI 2010 E-BOOK) (pp 233-236)
Author(s): Jianren Hu, Science School Hangzhou Dianzi University Hangzhou, 310037 China
Abstract: It comments how to pack IT products economically. That is important thing for anti-static, antishock, etc. There is over packaging by statistics and analysis of digital products. The calculating and designing results are less material wastage, less logistics cost. Some good examples that meets green packaging, green life are given. It comments how to meet logistics in electronic business modes. Integrative assemble IT is better than DIY for its great component surface and facing to the packing. We can get the volume less than former one’s, if selecting available packing technique. So do the total costs. It needs calling for available packaging in IT in our country to save resources and money.
Proceedings by Subjects
Resources
Products
Contact us
book@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1243940697
Book Publishing WeChat
Follow SCIRP
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top