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Proceedings of the 17th IAPRI World Conference on Packaging (IAPRI 2010 E-BOOK)

Tianjin,China,10.12-10.15，2010

ISBN: 978-1-935068-36-5 Scientific Research Publishing, USA

E-Book 886pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $80

Title: Experimental and FEM Research on Drop Tests of Electronic Devices
Source: Proceedings of the 17th IAPRI World Conference on Packaging (IAPRI 2010 E-BOOK) (pp 145-149)
Author(s): Xingzhou Li, The Department of Packaging Engineering, Shandong University Jinan, China
Guoqiang Zhang, The Department of Packaging Engineering, Shandong University Jinan, China
Daokun Dong, The Department of Packaging Engineering, Shandong University Jinan, China
Abstract: The ability of electronic devices, such as personal digital assistants and digital cameras，to withstand accidental impacts and shock is essential. In this paper, two research methods on a whole-packaged scanner’s ability of shock are employed. One is the experimental test in accordance with GB/T4857.5-92 about transport packages-vertical impact test method by dropping. During the test, the data acquisition device obtains useful data from strain gauges and acceleration sensors. To avoid the disadvantages of the experimental method, the finite element method is also conducted. An advanced analytical simulation for the various drop orientations is performed to evaluate the structural performance of the product and demonstrate their compliance with regulatory requirements. Comparisons show good correlation between experimental and finite element methods. In addition, this paper intends to provide some guidance on the research of packaging performance of electronic products.
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